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ANISOTROPIC CONDUCTIVE FILM AND METHOD FOR MANUFACTURING SAME, AND BONDING STRUCTURE AND ULTRASONIC BIOMETRIC IDENTIFICATION APPARATUS

2022
Online Patent
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The present invention relates to an anisotropic conductive film and a method for manufacturing same, and a bonding structure and an ultrasonic biometric identification apparatus. The anisotropic conductive film comprises first conductive particles and second conductive particles, wherein the particle size of the first conductive particles is less than the particle size of the second conductive particles, and the ratio of the number of the first conductive particles to the number of the second conductive particles is (3-8):1. The anisotropic conductive film is applicable to pins made of different materials, and is particularly applicable to a bonding structure where a pin made of a relatively hard material and a pin made of a relatively loose material exist at the same time, thereby ensuring that the anisotropic conductive film has a relatively low conduction impedance and excellent conduction stability on both of the two materials.

Titel:
ANISOTROPIC CONDUCTIVE FILM AND METHOD FOR MANUFACTURING SAME, AND BONDING STRUCTURE AND ULTRASONIC BIOMETRIC IDENTIFICATION APPARATUS
Link:
Veröffentlichung: 2022
Medientyp: Patent
Sonstiges:
  • Nachgewiesen in: USPTO Patent Applications
  • Sprachen: English
  • Document Number: 20220298315
  • Publication Date: September 22, 2022
  • Appl. No: 17/636742
  • Application Filed: December 09, 2019
  • Assignees: JIANGXI OUMAISI MICROELECTRONICS CO., LTD. (Nanchang, CN)
  • Claim: 1. An anisotropic conductive film, comprising a base resin, first conductive particles, and second conductive particles, wherein the first conductive particles and the second conductive particles are dispersed in the base resin, a particle size of the first conductive particles is smaller than a particle size of the second conductive particles, and a ratio of the number of the first conductive particles to the number of the second conductive particles is in a range of (3-8):1.
  • Claim: 2. anisotropic conductive film according to claim 1, wherein the particle size of the first conductive particles is in a range of 2 μm to 4 μm, and the particle size of the second conductive particles is in a range of 7 μm to 9 μm.
  • Claim: 3. The anisotropic conductive film according to claim 2, wherein the particle size of the first conductive particles is 3 μm, and the particle size of the second conductive particles is 8 μm.
  • Claim: 4. The anisotropic conductive film according to claim 1, wherein the ratio of the number of the first conductive particles to the number of the second conductive particles is 5:1.
  • Claim: 5. The anisotropic conductive film according to claim 1, wherein in the base resin, a density of the first conductive particles is in a range of 3000 pcs/mm2 to 5000 pcs/mm2, and a density of the second conductive particles is in a range of 600 pcs/mm2 to 1000 pcs/mm2.
  • Claim: 6. The anisotropic conductive film according to claim 1, wherein the first conductive particles and the second conductive particles are made of at least one material independently and respectively selected from carbon, metal, and metal/resin composite materials.
  • Claim: 7. The anisotropic conductive film according to claim 6, wherein the metal is at least one of nickel, copper, and palladium.
  • Claim: 8. The anisotropic conductive film according to claim 6, wherein the resin in the metal/resin composite material is at least one of epoxy resin and acrylic resin.
  • Claim: 9. The anisotropic conductive film according to claim 6, wherein the first conductive particles are made of nickel, and the second conductive particles are made of nickel/resin composite material.
  • Claim: 10. The anisotropic conductive film according to claim 1, wherein the base resin is at least one selected from acrylic resin and epoxy resin.
  • Claim: 11. A method for preparing an anisotropic conductive film, comprising: uniformly mixing first conductive particles, second conductive particles, and a base resin, and then curing, to obtain the anisotropic conductive film, wherein a particle size of the first conductive particles is smaller than a particle size of the second conductive particles, and a ratio of the number of the first conductive particles to the number of the second conductive particles is in a range of (3-8):1.
  • Claim: 12. The method according to claim 11, wherein the particle size of the first conductive particles is in a range of 2 μm to 4 μm, and the particle size of the second conductive particles is in a range of 7 μm to 9 μm.
  • Claim: 13. The method according to claim 12, wherein the particle size of the first conductive particles is 3 μm, and the particle size of the second conductive particles is 8 μm.
  • Claim: 14. The method according to claim 11, wherein the ratio of the number of the first conductive particles to the number of the second conductive particles is 5:1.
  • Claim: 15. The method according to claim 11, wherein in the anisotropic conductive film, a density of the first conductive particles is in a range of 3000 pcs/mm2 to 5000 pcs/mm2, and a density of the second conductive particles is in a range of 600 pcs/mm2 to 1000 pcs/mm2.
  • Claim: 16. A bonding structure, comprising a substrate and a flexible circuit board, wherein a first pin and a second pin are connected to the substrate; the first pin and the second pin are bonded to the flexible printed circuit board through an anisotropic conductive film, wherein the anisotropic conductive film is the anisotropic conductive film according to claim 1, or, the anisotropic conductive film is the anisotropic conductive film prepared by the method according to claim 11.
  • Claim: 17. The bonding structure according to claim 16, wherein the first pin and the second pin are made of different materials.
  • Claim: 18. The bonding structure according to claim 17, wherein the first pin is an indium tin oxide (ITO)-metal pin, and the second pin is a silver paste pin.
  • Claim: 19. An ultrasonic biometric device, comprising the bonding structure according to claim 16.
  • Current International Class: 08; 06; 08

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