Low-Temperature Wafer-Level Bonding with Cu-Sn-In Solid Liquid Interdiffusion for Microsystem Packaging
In: Microelectronic Engineering, Jg. 286 (2024-03-01)
Online
academicJournal
Zugriff:
Titel: |
Low-Temperature Wafer-Level Bonding with Cu-Sn-In Solid Liquid Interdiffusion for Microsystem Packaging
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Autor/in / Beteiligte Person: | Golim, Obert ; Vuorinen, Vesa ; Wernicke, Tobias ; Pawlak, Marta ; Paulasto-Kröckel, Mervi |
Link: | |
Zeitschrift: | Microelectronic Engineering, Jg. 286 (2024-03-01) |
Veröffentlichung: | 2024 |
Medientyp: | academicJournal |
ISSN: | 0167-9317 (electronic) |
DOI: | 10.1016/j.mee.2024.112140 |
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