Force Measurement with Piezo Electric Sensors in Advanced Packaging
In: International Wafer Level Packaging Conference (IWLPC); (2020-10-13) S. 1-7
Online
Konferenz
Zugriff:
Titel: |
Force Measurement with Piezo Electric Sensors in Advanced Packaging
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Autor/in / Beteiligte Person: | Hillinger, Robert |
Link: | |
Quelle: | International Wafer Level Packaging Conference (IWLPC); (2020-10-13) S. 1-7 |
Veröffentlichung: | 2020 |
Medientyp: | Konferenz |
ISBN: | 978-1-944543-16-7 (print) |
DOI: | 10.23919/IWLPC52010.2020.9375883 |
Sonstiges: |
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