Demonstration of Enhanced System-Level Reliability of Ultra-Thin BGA Packages with Circumferential Polymer Collars and Doped Solder Alloys
In: IEEE 66th Electronic Components and Technology Conference (ECTC); (2016-05-01) S. 1377-1385
Online
Konferenz
Zugriff:
Titel: |
Demonstration of Enhanced System-Level Reliability of Ultra-Thin BGA Packages with Circumferential Polymer Collars and Doped Solder Alloys
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Autor/in / Beteiligte Person: | Singh, Bhupender ; Huang, Ting-Chia ; Kawamoto, Satomi ; Sundaram, Venky ; Pulugurtha, Raj ; Smet, Vanessa ; Tummala, Rao |
Link: | |
Quelle: | IEEE 66th Electronic Components and Technology Conference (ECTC); (2016-05-01) S. 1377-1385 |
Veröffentlichung: | 2016 |
Medientyp: | Konferenz |
ISBN: | 978-1-5090-1204-6 (print) |
DOI: | 10.1109/ECTC.2016.351 |
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