Electronic assembly warranties challenge the industry to improve risk mitigation test methods
In: Pan Pacific Microelectronics Symposium (Pan Pacific); (2016) S. 1-13
Online
Konferenz
Zugriff:
Titel: |
Electronic assembly warranties challenge the industry to improve risk mitigation test methods
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Autor/in / Beteiligte Person: | McMeen, Mark ; Tynes, Jason ; Bixenman, Mike ; Lober, David |
Link: | |
Quelle: | Pan Pacific Microelectronics Symposium (Pan Pacific); (2016) S. 1-13 |
Veröffentlichung: | 2016 |
Medientyp: | Konferenz |
ISBN: | 978-0-9888873-9-8 (print) ; 978-1-944543-90-7 (print) |
DOI: | 10.1109/PanPacific.2016.7428406 |
Sonstiges: |
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