Integrated Thermal Management Strategies for 3D Chip Stacking with Through-Silicon Vias (TSV)
In: 4th International Conference on Innovative Research in Applied Science, Engineering and Technology (IRASET); (2024-05-16) S. 1-4
Online
Konferenz
Zugriff:
Titel: |
Integrated Thermal Management Strategies for 3D Chip Stacking with Through-Silicon Vias (TSV)
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Autor/in / Beteiligte Person: | Oukaira, Aziz ; Oumlaz, Maroua ; Zbitou, Jamal ; Lakhssassi, Ahmed |
Link: | |
Quelle: | 4th International Conference on Innovative Research in Applied Science, Engineering and Technology (IRASET); (2024-05-16) S. 1-4 |
Veröffentlichung: | 2024 |
Medientyp: | Konferenz |
ISBN: | 979-8-3503-0950-8 (print) |
DOI: | 10.1109/IRASET60544.2024.10548169 |
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