Analytical and Numerical Modeling of the Thermal Performance of 3D System-in-Package (SiP)
In: International Conference on Electrical, Computer and Energy Technologies (ICECET); (2023-11-16) S. 1-5
Online
Konferenz
Zugriff:
Titel: |
Analytical and Numerical Modeling of the Thermal Performance of 3D System-in-Package (SiP)
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Autor/in / Beteiligte Person: | Benelhaouare, Amrou Zyad ; Oumlaz, Maroua ; Oukaira, Aziz ; Lakhssassi, Ahmed |
Link: | |
Quelle: | International Conference on Electrical, Computer and Energy Technologies (ICECET); (2023-11-16) S. 1-5 |
Veröffentlichung: | 2023 |
Medientyp: | Konferenz |
ISBN: | 979-8-3503-2781-6 (print) |
DOI: | 10.1109/ICECET58911.2023.10389366 |
Sonstiges: |
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